Supports the integration and full automation of dual-arm robots and pre-alignment systems, with wafer sizes ranging from 100mm to 300mm, providing high WPH efficiency while supporting high-precision inspection, and supporting optional 2D/3D modular optical systems. The standard modular 2D system, which can achieve surface defect detection of 250nm and metal convex diameter or height detection of 50um, can realize online data collection and statistics, which is convenient for customers to analyze and optimize production efficiency and quality, so as to achieve visual production management.